The Higher Education Loans Board (HELB) has officially
opened its loan and scholarship application portal for the 2025-2026 academic
year.
The announcement comes as a relief to many students across
the country who rely on financial aid to pursue their education.
According to HELB, the portal is now open for both
first-time and continuing students.
This includes
applicants pursuing undergraduate and TVET (Technical and Vocational Education
and Training) courses in various institutions.
Financial aid is intended to support tuition fees and other education-related expenses for
deserving students.
First-time applicants are required to submit their
applications online by visiting the official website at www.hef.co.ke.
On the other hand,
continuing students can access the services through the USSD code *642# or by
using the HELB Mobile App, which is available for download.
The launch of this year’s loan application season is guided
by the Student-Centred Funding Model (SCFM), which is built on the principle
of “Leaving No Student Behind.”
The model aims to
ensure that all students, regardless of their background, have equal
opportunities to access higher education by receiving financial support based
on their level of need.
The message “Tumefungua Portal Sasa” is prominently featured in the official HELB notice, signalling the
urgency for students to act quickly and submit their applications within the
required timeframe.
Additionally, HELB has emphasised inclusivity by using the
tagline “Come Vile Uko, Tutakusort!”.
This highlights their commitment to ensuring that even
students from disadvantaged backgrounds are not excluded from the funding
process.
HELB continues to play a crucial role in supporting education in Kenya by offering loans and scholarships that enable thousands of students tostay in school and complete their studies.
Students are encouraged to apply early to avoid last-minute
inconveniences and ensure smooth processing of their applications.
